Hangzhou Liansheng Insulation Co.,Ltd

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HOME > Hangzhou Liansheng Insulation Co.,Ltd
Hangzhou Liansheng Insulation Co.,Ltd
TEL : 571-8863-7207 / FAX : 571-8863-4015 / Mobile : 158-6888-5015
CENLING ZHONGTAI YUHANG ZHEJIANG HANGZHOU China [CN]
Contact Name : Cynthia
Homepage : http://www.lesonccl.com
Main Products
FR4 epoxy fiberglass , FR4 copper clad lami , FR4 epoxy Fiberglass , G10.G11 material , Aluminum base copper
Business Type
Manufacturer
Product
Epoxy fiber glass copper clad laminate CCL
Posting date : Oct 30, 2014
Membership
Free Member Scince Oct 29, 2014
FOB Price
15
Min. Order Quantity
1
Supply Abillity
50000 SHEETS
Port
SHANGHAI
Payment Terms
TT / LC
Package
WOODEN PALLET
Keyword :
Category
Contact
Cynthia
Product Detail
Company Info
 
Quick Detail
Place of Origin
China [CN]
Brand Name
LESON
Model Number
CCL
HS-CODE
7410-21
Package & Delivery Lead Time
Package
WOODEN PALLET
Delivery Lead Time
5-18 DAYS
Specifications
Type of Certification
UL
Reference no.
E315523
Name.
UL
Issued By
UL LAB
Start Date (validity period)
0000-00-00
End Date (validity period)
0000-00-00
Scope
insulation material
Image

Detailed Description

Epoxy fiber glass copper clad laminate CCL 

1.Material

composite polymer(flame- retardant epoxy resin, E-glass fiber cloth with copper as cladding

2.Technics

Mixing ,Coating,Folding,Laminated,Return Line,Cutting,Packing

3.Color

natural color(light green ),yellow, and black,or as per customer's requirement

4.Measurement

41"X49",43"X49"(1040*1240mm)  

5. Feature:

Lead Free, Flame retardant, thermal reliability, lower warpage,

6.Using scope

Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process, etc.

7.Packing

carton packaging/ 250 sheet per pallet

8. Certification

ISO9001,ISO14001,CQC,UL

9.Payment

T/T,L/C, Western Union ,USD

10. Technological requirements

For your choices

 

 

 

Properities  

1.Tg≥130°C(DSC)

2.UV blocking and AOI compatible ,so as to increase productivity efficiency

3.High thermal performance ,Td ≥325°C,T288≥5min,suitable for lead-free process.

4.Good flatness, smooth surface,no pits 

Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process etc


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